Jerusalem, 29 July, 2025 (TPS-IL) — israeli startup Teramount has raised $50 million in a Series A round to scale production of its fiber-to-chip optical interconnect solutions, addressing the growing performance demands of AI infrastructure. The round was led by Koch Disruptive Technologies (KDT), with participation from AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund, Wistron, and Grove Ventures.

Teramount’s TeraVerse technology connects external optical fibers to silicon photonics chips, enabling faster, more efficient data movement in AI and data center systems. The funding will support the company’s transition to high-volume manufacturing ahead of broader industry adoption of co-packaged optics (CPO) systems.

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