Jerusalem, 17 December, 2025 (TPS-IL) — Israeli semiconductor equipment maker CoreFlow has unveiled a new 310 mm × 310 mm vacuum stage designed to address severe warpage in advanced panel-level chip packaging. The system targets CoPoS (chip-on-panel-on-substrate) manufacturing, which offers significantly more usable area than traditional 300 mm wafers and is increasingly used for AI-driven applications. Developed at CoreFlow’s headquarters and R&D center in Daliat-El Carmel, the clamp-free stage enables precise flattening of warped glass panels and is compatible with existing fab metrology, lithography, and inspection tools. The product is now available for order, with deliveries expected within 8–12 weeks.
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Israel’s CoreFlow Rolls Out New Solution for Warped Semiconductor Panels
Israeli semiconductor firm CoreFlow unveils a 310mm vacuum stage to fix severe warpage in advanced chip packaging, boosting AI applications. Product now.